Pages that link to "Item:Q1401103"
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The following pages link to Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging (Q1401103):
Displaying 3 items.
- A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies (Q1274163) (← links)
- A nonlocal diffuse interface model for microstructure evolution of tin--lead solder (Q1764682) (← links)
- Effects of the solder phase transformation on the optimization of reflow soldering parameters and temperature profiles (Q2045354) (← links)