A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies (Q1274163)
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scientific article; zbMATH DE number 1238233
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies |
scientific article; zbMATH DE number 1238233 |
Statements
A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies (English)
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12 January 1999
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process configuration
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thermal mass distribution
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temperature history
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0.7383787631988525
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0.6727237105369568
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