Pages that link to "Item:Q1695572"
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The following pages link to A theoretical analysis of the electromigration-induced void morphological evolution under high current density (Q1695572):
Displaying 7 items.
- Creep flow, diffusion, and electromigration in small scale interconnects (Q1019389) (← links)
- A thermodynamic model for electrical current induced damage (Q1434684) (← links)
- Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration (Q2134405) (← links)
- A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy (Q2205154) (← links)
- Electromigration induced strain field simulations for nanoelectronics lead-free solder joints (Q2271219) (← links)
- A phase field model for the electromigration of intergranular voids (Q2468800) (← links)
- Effect of electromigration on onset of morphological instability of a nanowire (Q6171107) (← links)