Pages that link to "Item:Q1852810"
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The following pages link to A phase field model for failure in interconnect lines due to coupled diffusion mechanisms. (Q1852810):
Displaying 18 items.
- Phase field computations for surface diffusion and void electromigration in \({\mathbb{R}^3}\) (Q600929) (← links)
- A theory for stress-driven interfacial damage upon cationic-selective oxidation of alloys (Q731129) (← links)
- Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces (Q833964) (← links)
- Creep flow, diffusion, and electromigration in small scale interconnects (Q1019389) (← links)
- Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects (Q1399667) (← links)
- A thermodynamic model for electrical current induced damage (Q1434684) (← links)
- A nonlocal diffuse interface model for microstructure evolution of tin--lead solder (Q1764682) (← links)
- Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405) (← links)
- Anisotropic phase field solution for morphological evolution and migration of inclusions in piezoelectric films (Q2009940) (← links)
- Isogeometric analysis for a phase-field constrained optimization problem of morphological evolution of vesicles in electrical fields (Q2021937) (← links)
- Damage evolution of polymer-matrix multiphase composites under coupled moisture effects (Q2060113) (← links)
- Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration (Q2134405) (← links)
- A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy (Q2205154) (← links)
- Electromigration induced strain field simulations for nanoelectronics lead-free solder joints (Q2271219) (← links)
- Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces (Q2385836) (← links)
- Electromigration failure of metal lines (Q2432249) (← links)
- A Cahn-Hilliard-Darcy model for tumour growth with chemotaxis and active transport (Q2806548) (← links)
- Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework (Q6171232) (← links)
