Pages that link to "Item:Q1956183"
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The following pages link to Influence of interfacial delamination on channel cracking of elastic thin films (Q1956183):
Displaying 16 items.
- An explicit elastic solution for a brittle film with periodic cracks (Q373359) (← links)
- Effect of elastic constants on crack channeling in a thin film bonded to an orthotropic substrate (Q399036) (← links)
- Edge delamination in an orthotropic bimaterial consisting of a thin film and a substrate (Q405037) (← links)
- Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis (Q442005) (← links)
- Analyses of crack growth along interface of patterned wafer-level cu-cu bonds (Q837885) (← links)
- Interaction between cracking, delamination and buckling in brittle elastic thin films (Q841923) (← links)
- Delamination in patterned films (Q869276) (← links)
- Kinetics of crack initiation and growth in organic-containing integrated structures (Q1434571) (← links)
- Mode-dependent toughness and the delamination of compressed thin films (Q1584900) (← links)
- Cracking in thin multi-layers with finite-width and periodic architectures. (Q1598311) (← links)
- Crack in an elastic thin-film with surface effect (Q1625066) (← links)
- Two-dimensional analysis of progressive delamination in thin film electrodes (Q1639755) (← links)
- Application of general regression neural network in identifying interfacial parameters under mixed-mode fracture (Q2083815) (← links)
- Interface cracking behavior in high-temperature coatings with non-uniformly distributed segmentation cracks (Q2168388) (← links)
- Channel cracking in inelastic film/substrate systems (Q2428351) (← links)
- Experimental and theoretical investigations of delamination at free edge of interface between piezoelectric thin films on a substrate (Q2458761) (← links)
