Pages that link to "Item:Q2045354"
From MaRDI portal
The following pages link to Effects of the solder phase transformation on the optimization of reflow soldering parameters and temperature profiles (Q2045354):
Displaying 3 items.
- A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies (Q1274163) (← links)
- Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging (Q1401103) (← links)
- Benchmark problems for the numerical schemes of the phase-field equations (Q2073574) (← links)