Pages that link to "Item:Q2205154"
From MaRDI portal
The following pages link to A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy (Q2205154):
Displaying 7 items.
- A theoretical analysis of the electromigration-induced void morphological evolution under high current density (Q1695572) (← links)
- A phase field model for failure in interconnect lines due to coupled diffusion mechanisms. (Q1852810) (← links)
- Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration (Q2134405) (← links)
- Electromigration induced strain field simulations for nanoelectronics lead-free solder joints (Q2271219) (← links)
- A phase field model for the electromigration of intergranular voids (Q2468800) (← links)
- Electromigration in Macroscopic Relaxation of Stepped Surfaces (Q3567052) (← links)
- Computation for electromigration in interconnects of microelectronic devices (Q5937908) (← links)