Pages that link to "Item:Q2299231"
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The following pages link to The effect of interfacial thermal resistance on interface crack subjected to remote heat flux (Q2299231):
Displaying 6 items.
- Thermal-mechanical interface crack behaviour of a surface mount solder joint (Q1274159) (← links)
- Interaction between a cracked hole and a line crack under uniform heat flux (Q1959835) (← links)
- A simple model for the study of the tolerance of interfacial crack under thermal load (Q2393336) (← links)
- A BEM analysis for thermomechanical closure of interfacial cracks incorporating friction and thermal resistance (Q2459293) (← links)
- Effect of partial closure of an interfacial crack with heat-conducting filler and surface films under thermal loading of bimaterial (Q2870379) (← links)
- РАЗРЕШИМОСТЬ ЗАДАЧИ О РАВНОВЕСИИ ДЛЯ ТЕРМОУПРУГОЙ ПЛАСТИНЫ КИРХГОФА – ЛЯВА С НАКЛОННОЙ ТРЕЩИНОЙ (Q6118452) (← links)