Pages that link to "Item:Q3440507"
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The following pages link to Numerical simulation of underfill encapsulation process based on characteritsic split method (Q3440507):
Displaying 4 items.
- The effective permeability of the underfill flow domain in flip-chip packaging (Q350443) (← links)
- Three-dimensional simulation of underfill process in flip-chip encapsulation (Q365295) (← links)
- Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging (Q416551) (← links)
- Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process (Q547705) (← links)