Three-dimensional simulation of underfill process in flip-chip encapsulation (Q365295)
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scientific article; zbMATH DE number 6204768
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Three-dimensional simulation of underfill process in flip-chip encapsulation |
scientific article; zbMATH DE number 6204768 |
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Three-dimensional simulation of underfill process in flip-chip encapsulation (English)
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4 September 2013
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underfill
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capillary action
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fluid flow
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simulation
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three-dimensional
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