Pages that link to "Item:Q365295"
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The following pages link to Three-dimensional simulation of underfill process in flip-chip encapsulation (Q365295):
Displaying 5 items.
- The effective permeability of the underfill flow domain in flip-chip packaging (Q350443) (← links)
- Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging (Q416551) (← links)
- Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process (Q547705) (← links)
- Microvia fill process model and control (Q2014816) (← links)
- Numerical simulation of underfill encapsulation process based on characteritsic split method (Q3440507) (← links)