Pages that link to "Item:Q1274174"
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The following pages link to Applications of FEM for multiple laminated structure in electronic packaging (Q1274174):
Displaying 4 items.
- Applications of finite element methods for reliability studies on ULSI interconnections. (Q626084) (← links)
- Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages (Q1274164) (← links)
- Closed form vs. finite element analysis of laminated stacks (Q1960437) (← links)
- The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure (Q2127930) (← links)