Pages that link to "Item:Q2385836"
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The following pages link to Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces (Q2385836):
Displaying 3 items.
- Reduction in vacuum phenomenon for the triple junction in the ternary Cahn-Hilliard model (Q823925) (← links)
- Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces (Q833964) (← links)
- A multi-phase-field model of void crossing grain boundary under electromigration-induced anisotropic surface diffusion in interconnects (Q6558121) (← links)
