Pages that link to "Item:Q3649349"
From MaRDI portal
The following pages link to Thermally induced deformations in die-substrate assembly (Q3649349):
Displaying 4 items.
- Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection (Q610410) (← links)
- Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages (Q1274164) (← links)
- Effect of heat on deformations in material with a defect (Q2284253) (← links)
- Numerical analysis on thermal characteristics for chip scale package by integrating 2D/3D models (Q3605175) (← links)