Pages that link to "Item:Q478321"
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The following pages link to Analysis of fatigue delamination growth in flip-chip package (Q478321):
Displaying 3 items.
- Fatigue and fracture assessment for reliability in electronics packaging (Q944280) (← links)
- Homogenization of delamination growth in an ACA flip-chip joint based on micropolar theory (Q1012260) (← links)
- A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces (Q2385851) (← links)