Pages that link to "Item:Q1949073"
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The following pages link to A microsystem for the fracture characterization of polysilicon at the micro-scale (Q1949073):
Displaying 10 items.
- Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (Q362016) (← links)
- Foreword: Micro- or nano-mechanics (Q400165) (← links)
- Multiscale modelling framework for the fracture of thin brittle polycrystalline films: application to polysilicon (Q487915) (← links)
- On-chip electrostatically actuated bending tests for the mechanical characterization of polysilicon at the micro scale (Q865134) (← links)
- Nanoscale damage during fracture in silica glass (Q865243) (← links)
- The effects of different boundary conditions on three-dimensional cracked discs under anti-plane loading (Q1669541) (← links)
- Predictions of strength in MEMS components with defects --- a novel experimental--theoretical approach (Q1777193) (← links)
- Analytical description of fracture features in single crystal silicon (Q2035173) (← links)
- Modeling elasticity of cubic crystals using a novel nonlocal lattice particle method (Q2133890) (← links)
- Fracture of solar-grade anisotropic polycrystalline silicon: a combined phase field-cohesive zone model approach (Q2310198) (← links)