Pages that link to "Item:Q2490881"
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The following pages link to Fatigue damage modeling in solder interconnects using a cohesive zone approach (Q2490881):
Displaying 9 items.
- Justification of Paris-type fatigue laws from cohesive forces model via a variational approach (Q851126) (← links)
- Process capability study and thermal fatigue life prediction of ceramic BGA solder joints (Q1274160) (← links)
- Dynamic edge debonding in FRP strengthened beams (Q1669452) (← links)
- A general phase-field model for fatigue failure in brittle and ductile solids (Q2039079) (← links)
- A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects (Q2385826) (← links)
- A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces (Q2385851) (← links)
- A simulation method for high-cycle fatigue-driven delamination using a cohesive zone model (Q2952882) (← links)
- Failure analysis of solder joints with a damage‐coupled viscoplastic model (Q4446624) (← links)
- Modelling of fracture by cohesive force models: a path to pursue (Q6049495) (← links)