Process capability study and thermal fatigue life prediction of ceramic BGA solder joints (Q1274160)
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scientific article; zbMATH DE number 1238232
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Process capability study and thermal fatigue life prediction of ceramic BGA solder joints |
scientific article; zbMATH DE number 1238232 |
Statements
Process capability study and thermal fatigue life prediction of ceramic BGA solder joints (English)
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12 January 1999
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process capability
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failure location
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elastic and elastic-plastic-creep analyses
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temperature cyclic condition
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0.8157903
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0.79952943
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0.79445153
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0.78637606
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0.7813359
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0.7800051
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