Pages that link to "Item:Q3510583"
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The following pages link to Investigation of model parameters of lead-containing and lead-free solders (Q3510583):
Displaying 12 items.
- Microstructure-dependent viscoplastic damage modelling of tin-lead solder (Q1019396) (← links)
- Comparative study on stress-strain hysteresis response of SAC solder joints under thermal cycles (Q1028753) (← links)
- Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging (Q1401103) (← links)
- A nonlocal diffuse interface model for microstructure evolution of tin--lead solder (Q1764682) (← links)
- Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods (Q1952390) (← links)
- Effects of the solder phase transformation on the optimization of reflow soldering parameters and temperature profiles (Q2045354) (← links)
- Nanoindentation: a suitable tool to determine local mechanical properties in microelectronic packages and materials? (Q2432398) (← links)
- Reexamination of the solder ball shear test for evaluation of the mechanical joint strength (Q2459846) (← links)
- Phase field dependent viscoplastic behaviour of solder alloys (Q2500547) (← links)
- Determining Material Parameter of Solder Alloys by Nanoindentation (Q3176929) (← links)
- Solder joint lifetime assessment of electronic devices (Q4398054) (← links)
- Some Physical Properties of Wiping Solders* (Q4483323) (← links)