Pages that link to "Item:Q400172"
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The following pages link to Experimental evaluation and numerical modeling of adhesion phenomena in polysilicon MEMS (Q400172):
Displaying 5 items.
- Modelling of spontaneous adhesion phenomena in Micro-Electro-Mechanical Systems (Q335195) (← links)
- On-chip electrostatically actuated bending tests for the mechanical characterization of polysilicon at the micro scale (Q865134) (← links)
- Adhesion of micro-cantilevers subjected to mechanical point loading: modeling and experiments. (Q1421370) (← links)
- Evaluation of adhesion in microsystems using equivalent rough surfaces modeled with spherical caps (Q1658038) (← links)
- A probabilistic model for predicting the uncertainties of the humid stiction phenomenon on hard materials (Q2352305) (← links)