Pages that link to "Item:Q4620158"
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The following pages link to Optimizing a blend of a mixture slurry in chemical mechanical planarization for advanced semiconductor manufacturing using a posterior preference articulation approach to dual response surface optimization (Q4620158):
Displaying 3 items.
- A novel approach to hedge and compensate the critical dimension variation of the developed-and-etched circuit patterns for yield enhancement in semiconductor manufacturing (Q337307) (← links)
- Geometric advection and its application in the emulation of high aspect ratio structures (Q2246344) (← links)
- Layers of Experiments with Adaptive Combined Design (Q5249466) (← links)