Pages that link to "Item:Q1274160"
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The following pages link to Process capability study and thermal fatigue life prediction of ceramic BGA solder joints (Q1274160):
Displaying 5 items.
- Thermal stress and fatigue analysis of plated-through holes using an internal state variable constitutive model (Q1274155) (← links)
- A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies (Q1274163) (← links)
- Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending (Q1953270) (← links)
- Numerical analysis on thermal characteristics for chip scale package by integrating 2D/3D models (Q3605175) (← links)
- Finite element modelling of ceramics and glass (Q4952960) (← links)