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Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending - MaRDI portal

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Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending (Q1953270)

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scientific article; zbMATH DE number 6171746
Language Label Description Also known as
English
Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending
scientific article; zbMATH DE number 6171746

    Statements

    title
    Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending (English)
    0 references
    author
    Yanyan Li
    0 references
    publication date
    7 June 2013
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    zbMATH Keywords
    analytical solutions
    0 references
    mechanical bending
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    drop shock
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    solder joints
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    electronic packaging
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    Identifiers

    zbMATH DE Number
    6171746
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    OpenAlex ID
    W2007699301
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