Pages that link to "Item:Q2385851"
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The following pages link to A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces (Q2385851):
Displaying 6 items.
- Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (Q362016) (← links)
- Analysis of fatigue delamination growth in flip-chip package (Q478321) (← links)
- Isogeometric enriched field approximations (Q503923) (← links)
- Fatigue and fracture assessment for reliability in electronics packaging (Q944280) (← links)
- Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods (Q1952390) (← links)
- Fatigue damage modeling in solder interconnects using a cohesive zone approach (Q2490881) (← links)