Pages that link to "Item:Q1000849"
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The following pages link to Modeling and calculation of slurry-chemistry effects on chemical-mechanical planarization with a grooved pad (Q1000849):
Displaying 3 items.
- Analytical solution for Polish-rate decay in chemical--mechanical polishing (Q718931) (← links)
- Mathematical modeling of polish-rate decay in chemical-mechanical polishing (Q1861661) (← links)
- Optimizing a blend of a mixture slurry in chemical mechanical planarization for advanced semiconductor manufacturing using a posterior preference articulation approach to dual response surface optimization (Q4620158) (← links)