Pages that link to "Item:Q1028753"
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The following pages link to Comparative study on stress-strain hysteresis response of SAC solder joints under thermal cycles (Q1028753):
Displaying 6 items.
- Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection (Q610410) (← links)
- Thermal stress and fatigue analysis of plated-through holes using an internal state variable constitutive model (Q1274155) (← links)
- Process capability study and thermal fatigue life prediction of ceramic BGA solder joints (Q1274160) (← links)
- A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects (Q2385826) (← links)
- Reexamination of the solder ball shear test for evaluation of the mechanical joint strength (Q2459846) (← links)
- Solder joint lifetime assessment of electronic devices (Q4398054) (← links)