Pages that link to "Item:Q1274159"
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The following pages link to Thermal-mechanical interface crack behaviour of a surface mount solder joint (Q1274159):
Displaying 14 items.
- Implementation of the numerical manifold method for thermo-mechanical fracture of planar solids (Q463516) (← links)
- Analysis of fatigue delamination growth in flip-chip package (Q478321) (← links)
- Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method (Q535756) (← links)
- Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection (Q610410) (← links)
- Thermal stress and fatigue analysis of plated-through holes using an internal state variable constitutive model (Q1274155) (← links)
- Process capability study and thermal fatigue life prediction of ceramic BGA solder joints (Q1274160) (← links)
- Effect of geometric parameters on popcorn cracking in plastic packages during VPS process (Q1274166) (← links)
- Parametric study of mode I energy release rate of soldered joints. (Q1605188) (← links)
- Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending (Q1953270) (← links)
- Vapor pressure and residual stress effects on failure of an adhesive film (Q2385877) (← links)
- Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies (Q2456310) (← links)
- Reexamination of the solder ball shear test for evaluation of the mechanical joint strength (Q2459846) (← links)
- Finite element model analysis of thermal failure in connector (Q2644542) (← links)
- Failure analysis of solder joints with a damage‐coupled viscoplastic model (Q4446624) (← links)
