Pages that link to "Item:Q1952390"
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The following pages link to Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods (Q1952390):
Displaying 6 items.
- Thermal-mechanical interface crack behaviour of a surface mount solder joint (Q1274159) (← links)
- Process capability study and thermal fatigue life prediction of ceramic BGA solder joints (Q1274160) (← links)
- A nonlocal diffuse interface model for microstructure evolution of tin--lead solder (Q1764682) (← links)
- A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces (Q2385851) (← links)
- Solder joint lifetime assessment of electronic devices (Q4398054) (← links)
- Failure analysis of solder joints with a damage‐coupled viscoplastic model (Q4446624) (← links)