Pages that link to "Item:Q2385826"
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The following pages link to A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects (Q2385826):
Displaying 10 items.
- Microstructure-dependent viscoplastic damage modelling of tin-lead solder (Q1019396) (← links)
- Comparative study on stress-strain hysteresis response of SAC solder joints under thermal cycles (Q1028753) (← links)
- Thermal-mechanical interface crack behaviour of a surface mount solder joint (Q1274159) (← links)
- Process capability study and thermal fatigue life prediction of ceramic BGA solder joints (Q1274160) (← links)
- Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods (Q1952390) (← links)
- The temperature-dependent fractional evolutional model for sintered nanoscale silver films (Q1982351) (← links)
- Nanoindentation of Pb/Sn solder alloys; experimental and finite element simulation results (Q2458797) (← links)
- Fatigue damage modeling in solder interconnects using a cohesive zone approach (Q2490881) (← links)
- Solder joint lifetime assessment of electronic devices (Q4398054) (← links)
- Failure analysis of solder joints with a damage‐coupled viscoplastic model (Q4446624) (← links)