Pages that link to "Item:Q4398054"
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The following pages link to Solder joint lifetime assessment of electronic devices (Q4398054):
Displaying 10 items.
- Thermal ratcheting of solder-bonded elastic and elastoplastic layers (Q939308) (← links)
- Comparative study on stress-strain hysteresis response of SAC solder joints under thermal cycles (Q1028753) (← links)
- Process capability study and thermal fatigue life prediction of ceramic BGA solder joints (Q1274160) (← links)
- Parametric study of mode I energy release rate of soldered joints. (Q1605188) (← links)
- Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods (Q1952390) (← links)
- Generalized strain space formulations and eigenprojection tensors (Q2285693) (← links)
- A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects (Q2385826) (← links)
- A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces (Q2385851) (← links)
- Fatigue damage modeling in solder interconnects using a cohesive zone approach (Q2490881) (← links)
- Investigation of model parameters of lead-containing and lead-free solders (Q3510583) (← links)