Pages that link to "Item:Q4446624"
From MaRDI portal
The following pages link to Failure analysis of solder joints with a damage‐coupled viscoplastic model (Q4446624):
Displaying 13 items.
- Microstructure-dependent viscoplastic damage modelling of tin-lead solder (Q1019396) (← links)
- Comparative study on stress-strain hysteresis response of SAC solder joints under thermal cycles (Q1028753) (← links)
- Thermal-mechanical interface crack behaviour of a surface mount solder joint (Q1274159) (← links)
- Process capability study and thermal fatigue life prediction of ceramic BGA solder joints (Q1274160) (← links)
- Parametric study of mode I energy release rate of soldered joints. (Q1605188) (← links)
- Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods (Q1952390) (← links)
- Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending (Q1953270) (← links)
- A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects (Q2385826) (← links)
- Fatigue damage modeling in solder interconnects using a cohesive zone approach (Q2490881) (← links)
- Phase field dependent viscoplastic behaviour of solder alloys (Q2500547) (← links)
- Investigation of model parameters of lead-containing and lead-free solders (Q3510583) (← links)
- Solder joint lifetime assessment of electronic devices (Q4398054) (← links)
- Some Physical Properties of Wiping Solders* (Q4483323) (← links)